1969
A new factory for graphic equipment is constructed and extended during
the following years.
1972
Bacher develops the Bacher CONTROL 2000 Register System for the reduction
of set-up times on offset presses. The Heidelberger Druckmaschinen AG
immediately recognizes its advantages and adopts the system. Today Bacher
holds the leading position world-wide in register systems.
1976
Bacher incorporates repro cameras and platemakers into its product line.
1980
Bacher starts with the development and production of manual PCB exposure
systems for well-known companies like BASF, Ciba-Geigy and Hoechst.
1986
At DRUPA Bacher is the first to introduce an innovation: the image changing
system on the new fully automatic Step- and Repeat and Assembly machine.
And a second new development: the high performance Daylight Platemaker
for quality reproduction.
1993
Market launch of the fully automatic exposure system FAPS 600 during
the Productronica in Munich.
1996
Bacher becomes the European market leader in automatic PCB exposure
systems. Introduction of the machine in the USA.
1997
Introduction of the newly developed fully automatic innerlayer system
ILS 700 and the fully automatic post etch punch system PEPS 600.
1998
Foundation of B. Bacher, Inc. in the USA
1999
Introduction of the new automatic turbo post etch punch system PEPS
700. Foundation of Bacher ASIA Ltd. in Hong Kong and Bacher Taiwan Ltd.
2001
The fully automatic exposure system FAPS 600 and the fully automatic
innerlayer system ILS 700 are introduced in a compact chassis made of
stainless steel. More than 300 FAPS 600 automatic exposure units have
now been delivered to the market place.
2003
Bacher is integrated in the Skybrain Holding, which contains already
Schmoll Maschinen, Schmoll Asia Pacific, LHMT and Posalux.
2003
Introduction of the newly developed semi - automatic exposure system
SAPS 700, the manual exposure system MOPS 700 and the manual post etch
punch system PEPS 700 M.
2004
Development of semi-automatic post etch punch PEPS 700MA.
2005
Development and market introduction of
eXos 4x4 cameras for double-sided exposure of soldermask
CO/LI/BRI SupraLight for exposure of innerlayer, outerlayer and soldermask
PICO SupraLight: the little sister of CO/LI/BRI especially designed for production of small batches and prototypes
2006:
Introduction of automatic post etch punch PEPS 700A with 4x4 cameras and Front-Back-Verification
2006/2007
Development of automatic exposure system with SupraLight, throughput 8 panels/min
2009
Relocation to Neuhausen / Enzkreis
With the stated company goal of developing and producing equipment that is at the fore- front of technology, of high quality and longevity, Bacher looks into a very positive future.
